HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

    Package Design Team services include:

?  Customer-centric design.

?  High quality, reliable, and cost effective packaging proposal.

?  DFM (Design For Manufacturing) and DFC (Design for Cost).

?  Supporting auto- check of design and Drawings.

Design Capabilities:

   Multi-Chip Modules（MCM）

   System-in-Package (SiP)

   Flip Chip Package

   Hybrid Package

   Package-in-Package (PiP)

   Package-on-Package (PoP)

   Embedded Package