Design services
來源: 發布時間:2016/4/15 16:21:48 瀏覽次數:0次
HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.
Package Design Team services include:
? Customer-centric design.
? High quality, reliable, and cost effective packaging proposal.
? DFM (Design For Manufacturing) and DFC (Design for Cost).
? Supporting auto- check of design and Drawings.
Design Capabilities:
Multi-Chip Modules(MCM)
System-in-Package (SiP)
Flip Chip Package
Hybrid Package
Package-in-Package (PiP)
Package-on-Package (PoP)
Embedded Package
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Simulation services
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